May 21-22, 2026 | Frankfurt, Germany
2nd European Automotive E/E Systems Summit 2026
2nd European Automotive E/E Systems Summit 2026
May 21-22, 2026 | Frankfurt, Germany
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The summit will be held in-person and online
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Speakers
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Tickets
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Enterprises
Summit Background
As the automotive industry accelerates toward a software-defined vehicle (SDV) future, the evolution of E/E architecture has become the backbone for enabling centralized computing, intelligent driving, and seamless over-the-air services. OEMs and Tier 1/2 suppliers now face mounting pressure to integrate powerful hardware platforms with flexible, scalable software stacks-all while balancing safety, performance, and cost-efficiency. At the same time, the explosive advancement of Artificial Intelligence (AI), particularly breakthroughs in large models for perception, decision-making, and generative tasks, is reshaping E/E architecture design paradigms with unprecedented force. AI is not only key to realizing high-level autonomous driving but is also driving a fundamental shift from distributed to centralized and zonal architectures, accelerating the maturation of Service-Oriented Architecture (SOA) and Zonal Control. This summit centered on the theme "E/E Architecture Innovation in the Age of AI and SDV", will bring together leading global OEMs, Tier 1 suppliers, technology giants, and academic pioneers to explore how next-generation E/E architecture is shaping the foundation of intelligent vehicles; and discuss how AI acts as a central driving force, guiding the next revolution in E/E architecture across computing, communication, power distribution, and hardware-software integration—laying a solid foundation for building more efficient, intelligent, and secure future vehicles.
Topics
➤ Driving Software-Centric Innovation: What’s Next for E/E Architecture
➤ From Distributed to Centralized: Architecting the Future of E/E Systems with AI
➤ The AI-Driven Automotive Revolution: From Centralized Computing to Autonomous Mobility
➤ Unlocking Central Compute Performance: How High-Speed In-Vehicle Networks Power AI-Defined Vehicle
➤ Next-Generation E/E Architectures: Scalability, AI Integration & Multi-Path Electrification
➤ Towards Gigabit Ethernet in SDV: OEM Challenges in Scaling Bandwidth, Safety and Real-Time Communication
➤ Sensor Fusion Architecture: Delivering High-Quality Data for AI
➤ Designing the Data Backbone: High-Speed In-Vehicle Networks in Centralized Vehicle Architectures
➤ Road to Cloud Mobility: Cross- Domain E/E Architecture Powering in SDV Era
➤ Securing SDV: From Embedded Security to Secure Boot and Partitioning
Previous Speakers
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Jeremie Bouchaud
Director, EE & Semiconductor, SDV, Autonomy
S&P Global Mobility
Jean-Pierre DUMOULIN
Senior Automotive consultant - ex Global Stellantis Connectivity VP
JPSD Consulting
Johannes Krieg
Manager Software Defined Car
Mercedes-Benz Tech Innovation
Dr. Sergey Tverdyshev
Chief Architect
NIO GmbH
Romain Ygnace
Principal SoC Engineer
NVIDIA
Prof. Dirk Slama
Vice President Partner Ecosystems
Bosch
Serino Angellotti
Deputy Managing Director, Head of Product Research and Development
Lotus Tech Innovation Centre
Miloš Krčobić
Technical Lead for Electrical Engineering / Electrical Architecture
Bugatti-Rimac
Dragos Bohotineanu
Head of Product Group Zone Control Units
Continental Automotive
Emilio Guijarro Cameros
Principal Automotive Applications Engineer
Real-Time Innovations (RTI)
Stefan Pruisken
Senior Director, Product Management Electronics Digital Twins
Synopsys Inc.
Conhas Thakkar
Principal Solution Architect
Siemens EDA
Marius Mailat
CTO/Managing Director
P3 Digital Services GmbH
Karl Schlauch
Principal CyberSecurity - Threat Research
VicOne
Dr.-Ing Ashar Javed
Head of Security Technology Section & CISO
Hyundai AutoEver Europe GmbH
Visvesh Saravanan
Senior Manager, Telematics Engineering, SBU Connectivity
Harman International (a Samsung company)
Andreas vom Felde
Head of Sales Europe
Zendar
MULTIPLE SPONSORSHIP FORMS
Diamond Sponsor Presentation Sponsor Exhibition/Booth Sponsor Panel Discussion Sponsor Tea Break Video Sponsor Gift Sponsor...
Why you must attend 2026
Networking
Knowledge and Insight
Potential Cooperation Opportunities
Roundtables and Workshops
Exposure and Branding
Professional Service
PARTICIPATION FORMATS
In-Person Registration
A. The fee is inclusive of two days conference, conference materials, two luncheons and all refreshments. Accommodation and travel is not included.
B. Video recording for the entire event.
Live Broadcasting Registration
A. The fee is inclusive of two-day conference’s live broadcasting and conference materials.
B. Video recording for the entire event.
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Any problems or questions please call:+86 21 66059539-813, or email us: marketing@ecvinternational.com
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