November 9-10, 2026 | Frankfurt
Europe Data Center Cooling and Thermal Management Forum 2026
Europe Data Center Cooling and Thermal Management Forum 2026
November 9-10, 2026 | Frankfurt
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Not Just Cooling, But Thermal Management
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Speakers
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Enterprises
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Attendees
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Case Studies
Who’s Already Attending
Leading data center operators, cooling solution providers, and infrastructure innovators have already secured their seats. Join them in Frankfurt this November.
About the Summit
The Europe Data Center Cooling and Thermal Management Forum 2026 will take place in Frankfurt, Germany, on November 9-10, 2026 — at the heart of Europe’s digital infrastructure. Key Themes of the Forum • AI-Driven Data Center and Cooling Market Dynamics, Opportunities, and Infrastructure Transformation • Scaling Liquid Cooling: From Pilot to Industrial Deployment of D2C and Immersion Cooling • Energy Efficiency, Cost Optimization, and PUE Management in High-Density Environments • Sustainable Data Center Development in Europe: Heat Reuse, Water Efficiency (WUE), and Decarbonization Policie Join us to shape the next decade of data center cooling: resilient, efficient, and built for the AI era.
Topics
➤ A New Blueprint for Data Center Growth in the AI Era
➤ How Operators Are Responding to High-Density AI Workloads
➤ Reshaping the Data Center Thermal Management Market in the Age of AI
➤ 100kW Racks and Beyond: The New Thermal Challenge
➤ Panel Discussion: Next-Gen AI, Next-Gen Data Centers, Next-Gen Cooling
➤ Next-Generation Data Center Site Selection and Development Strategies
➤ Retrofitting Strategies for Legacy Air-Cooled Data Centers
➤ Data Center Delivery Challenges in the AI Compute Race: Are Prefabricated Modular Data Centers the Answer?
➤ Waste Heat Recovery: A Win-Win Path for Decarbonization and Revenue
➤ Panel Discussion: Managing PUE & WUE Under Surging AI Demand and Tightening Regulations
➤ Entering the Rubin Era: How Next-Generation AI Chips Will Reshape Data Center Thermal Management
➤ Immersion, Direct-to-Chip or Hybrid? Cooling Choices for Hyperscale AI Data Centers
➤ Panel Discussion: Cooling Architecture from Chip to Data Center
➤ Smarter Cooling with AI: Optimizing Data Center Thermal Management
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Our Supporting Partners
Main Participating Groups
Positions of attendees
CEO/CTO/CIO/VP
GM/Deputy GM
Head of Infrastructure
Head of Operation
Head of Construction & Delivery
Head of Colling/CRAH
Head of HPC
Head of Sustainability/ESG
Technology Director/Manager
Engineering Director/Manager
Human Resources Director/Manager
BD Director/Manager
Marketing Director/Manager
Sales Director/Manager
CRAH/Liquid Cooling Engineer
Expert/Specialist/Analyst/Advisor
Why you must attend 2026
Stay Ahead in the AI-Driven Era
Navigate Regulatory Shifts with Confidence
Explore Cutting-Edge Cooling Technologies
Connect with the Industry’s Most Influential Players
Address the Full Spectrum of Operational Challenges
Position Your Brand at the Heart of Europe’s Digital Transition
MULTIPLE SPONSORSHIP FORMS
Diamond Sponsor Presentation Sponsor Exhibition/Booth Sponsor Panel Discussion Sponsor Tea Break Video Sponsor Gift Sponsor...
PARTICIPATION FORMATS
In-Person Registration
• Access to two main conference days 
• Full set of conference materials 
• Two luncheons and all refreshments during networking breaks
• Full video recording of the entire event
• 10+ hours of dedicated networking breaks with 100+ data center and cooling professionals
Live Broadcasting Registration
• Live access to two main conference days 
• Digital conference materials
• Full video recording of the entire event
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Any problems or questions please email us: marketing@ecvinternational.com
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