April 26-27, 2027 | Frankfurt
European Data Center Optical Connectivity Forum 2027
European Data Center Optical Connectivity Forum 2027
April 26-27, 2027 | Frankfurt
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The summit will be held in-person and online
Summit Background

AI infrastructure is rapidly reshaping data centre network architecture, driving demand for higher bandwidth, greater density, lower power consumption and more scalable connectivity. As AI clusters expand across racks, data halls and multiple facilities, traditional interconnect architectures are being pushed to their limits, accelerating the transition toward 800G, 1.6T, CPO, optical I/O and optical switching.

While many next-generation optical interconnect roadmaps are being driven by global hyperscalers, AI compute platforms and semiconductor companies, their deployment in Europe will depend on regional infrastructure requirements, operator priorities and supply-chain readiness.

The European Data Center Optical Connectivity Forum will connect global technology leaders with European data centre operators, cloud and network infrastructure stakeholders, and Europe’s photonics and manufacturing ecosystem. Discussions will focus on how next-generation optical technologies can move from architecture and product development toward reliable, serviceable and commercially scalable deployment across European AI infrastructure.

Topics
Data Center Optical Connectivity Market and Technology Outlook
AI Workloads Reshape Data Center Optical Connectivity Architecture
800G Optical Connectivity for AI Data Center Deployments
Scaling 800G and 1.6T Optical Transceivers for AI Data Centers
Testing, Qualification and Reliability for 1.6T Optical Interconnects
Optical Circuit Switching for Large-Scale AI Infrastructure
High-Speed Interconnects and Optical Engines for AI Switching Architectures
Co-Packaged Optics for Next-Generation AI Networks
Optical Connectivity for Scale-Across AI Infrastructure
Panel Discussion: Interconnect Options for AI Scale-Up and Scale-Out: What Gets Deployed Where?
Silicon Photonics for AI Data Center Interconnects
Scaling Optical Sources for Next-Generation AI Interconnects
Packaging, Manufacturing and Qualification for High-Volume Optical Interconnects
Optical Connectivity Requirements for AI Data Center Infrastructure
AI Infrastructure at Scale: Network Architecture and Optical Connectivity Requirements
Optical DSPs for 1.6T and Next-Generation AI Interconnects
Ethernet Switching and Optical Interconnect Architecture for AI Clusters
Switch Silicon, SerDes and Optical Engine Integration for Next-Generation AI Networks
Closing Panel: What Must Be Solved Before Next-Generation Optics Are Ready for AI-Scale Deployment?
MULTIPLE SPONSORSHIP FORMS
Diamond Sponsor Presentation Sponsor Exhibition/Booth Sponsor Panel Discussion Sponsor Tea Break Video Sponsor Gift Sponsor...
Main Participating Groups
Positions
· Executive Management / C-Level
· AI & Data Center Infrastructure
· Network & System Architecture
· Optical / Photonics Engineering
· Silicon Photonics & Optical Engines
· DSP / SerDes / Signal Integrity
· Packaging / Manufacturing / Assembly
· Test / Validation / Reliability
· Product Management
· Strategic Sourcing / Procurement
· Sales / Marketing
· R&D / Advanced Technology
6 Reasons to Attend
Master the 800G → 1.6T Transition — Explore the next generation of AI optical connectivity.
Decode AI Connectivity Trends — Understand how AI workloads are reshaping data center networks.
Explore CPO & Silicon Photonics — Discover the technologies transforming high-speed interconnects.
Solve Power & Density Challenges — Learn how to address bandwidth, power, thermal and reliability demands.
Connect With Industry Leaders — Meet hyperscalers, data centers, optical, semiconductor and networking experts.
Turn Technology Into Deployment — Gain practical insights into scaling next-generation optical connectivity.
PARTICIPATION FORMATS
In-Person Registration
• Full Two‑Day Access – Attend all strategic keynotes, case studies, and panel discussions 
• Premium On‑site Experience – Receive your summit kit, enjoy two luncheons, and take part in all coffee breaks
• Complete Post‑Event Documentation – Get full video recordings and presentation slide decks (where permitted)
Live Broadcasting Registration
• Real‑Time Remote Access – Join the entire two‑day summit live from anywhere in the world, with interactive Q&A opportunities
• Full Event Recording – Watch the complete summit on‑demand after the event, so you never miss a session
• Digital Handouts – Receive electronic copies of available presentation materials 
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Any problems or questions please call:+86 13271915990, or email us: marketing@ecvinternational.com